SOW_18-8J2_REDACTED.PDF
Published: 08/23/2018
Description
STATEMENT OF WORK (SOW) DMEA 18-8J2 30 July 2018 Project Engineer: 1.0 SCOPE: 1.1 TITLE: Wafer/Frame Film Applicator 1.2 APPLICABILITY: A Wafer Back Grinder will be used to reduce the thickness of wafers, and D Saw is used to cut out individual ...
