18-8J6_SOW,_WAFER_SURFACE_ROUGHNESS_METROLOGY_TOOL_R.PDF
Published: 08/31/2018
Description
STATEMENT OF WORK (SOW) DMEA 18-8J6 13 Aug 2018 Project Engineer: Steven Nelson, DMEA/MEBC, (916) 999-2785 1.0 SCOPE: 1.1 TITLE: Wafer Surface Roughness Metrology Tool 1.2 APPLICABILITY: The Disco Surface Grinder will be used to reduce...
