SOW_19-9D5__DIE_BONDER_FLIP_CHIP_MODULE_7MAY2019_POAPPROVED.PDF
Published: 05/16/2019
Description
STATEMENT OF WORK (SOW) DMEA 19-9D5 7 May 2019 Project Engineer: Stephanie Wasmuth, DMEA/MEBC, (916) 999-2608 1.0 SCOPE: 1.1 TITLE: Equip-Flip-Chip C4 Die Bonder Module 1.2 APPLICABILITY: 1.3 BACKGROUND: With the up and coming 90...
