SECURE PACKAGE
Published: 05/16/2019
Description
SOW_19-9D5__Die_Bonder_Flip_Chip_Module_7MAY2019_POapproved.pdf STATEMENT OF WORK (SOW) DMEA 19-9D5 7 May 2019 Project Engineer: Stephanie Wasmuth, DMEA/MEBC, (916) 999-2608 1.0 SCOPE: 1.1 TITLE: Equip-Flip-Chip C4 Die Bonder Modul...
