RFB#AA14-GD-4920 WAFER SAW FLIP CHIP BONDER WIRE BONDER FOR STUD BUMPING WIRE BONDER FOR COPPER BONDING, UNIVERSITY OF MASSACHUSETTS-AMHERST
Published: 03/28/2014
Description
U N I V E R S I T Y O F M A S S A C H U S E T T S REQUEST FOR BID WAFER SAW, FLIP CHIP BONDER, WIRE BONDER FOR STUD BUMPING, WIRE BONDER FOR COPPER BONDING RFB AA14-GD-4920 S U B M I T T E D B Y T H E U N I V E R S I T Y O F M A S S A C H U S E T T S...
