SOW_14-4G7
Published: 06/16/2014
Description
STATEMENT OF WORK (SOW) DMEA 14-4G7 22 May 2014 1.0 SCOPE: 1.1 TITLE: Purchase a Disco Model DFD6341 Fully Automatic Wafer Dicing Saw 1.2 APPLICABILITY: DMEA Package Assembly Substrate (PAS) Lab 1.3 BACKGROUND: The current wafer dicing saw is over 14...
